UF200R
Fully automatic Wafer Prober for 120 to 200 mm wafers
High Throughput
Wide Scope of Application
High Planning Safety
Numerous Options for Upgrading
Wide Scope of Application
High Planning Safety
Numerous Options for Upgrading
- Now with the latest SW and Electronics generation
- Also available for numerous special applications, such as MEMS wafer handling
- Highest speed 300 mm/s in the XY-axis, 30 mm/s in the Z-axis, spindle rotation angle +-5 deg
- With second card feeder as an option
- Wafer Handling with robot arm and backside holding
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