PS280

Package dicer with 2 independent cutting stations

Very high cutting speed

High efficiency

Considerable cost reductions

Easy maintenance
ACCRTECH Europe GmbH - Produkte - Semiconductor - %%title%%
  • Dual cutting stage mechanism with parallel spindle and drive shaft
  • Independent microscope drive mechanism
  • Simultaneous cutting and positioning
  • Highest dicing speed
  • High cutting range for smooth scrap processing and simple maintenance
  • 17-inch touch panel monitor for easy operation
  • Improved optical system with large field of vision and high resolution – reduces alignment errors and reduces positioning time
  • USB interface system for simple upgrades and safe data storage
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