Wafer Dicing Machines – Package Dicer

Remain competitive. Reduced costs and increased efficiency are increasingly important in the high volume production of semiconductor elements. With our Dicer package, we offer a complete solution for the separation of BGA and QFN products. The dicing machine is directly coupled to a pick-and-place system. With its newly developed technology with two independent stages and transportation routes, this dicer has great potential for reducing operating costs (“cost of ownership”)

Package Dicer

High speed, high cycle rate, high cost savings. Our PS280 package singulation system carries out several work stages in parallel The large 17-inch touchscreen monitor also ensures easy operation.

 PS 280