Conditioning Plates
Conditions the hub blade in a short time
Significant production cost reduction by replacing the silicon pre-cutting
Conditions the hub blade in a short time
Significant production cost reduction by replacing the silicon pre-cutting
Features
The RGC series conditioning plate significantly reduces the startup time of the fine-grained blade.
By using it before wafer dicing of the silicon or the compound semiconductor, etc., an excellent unclogged state of the blade tip is achieved, so improving the processing product rank.
This achieves a significant reduction in the required time compared to the conventional process.
By using it before wafer dicing of the silicon or the compound semiconductor, etc., an excellent unclogged state of the blade tip is achieved, so improving the processing product rank.
This achieves a significant reduction in the required time compared to the conventional process.
Specifications
The lineup of blade types according to each grit diameter
Standard size
- Please consult with us for customized dimensions.
| Specifications | Bond | Grit type | Thickness | Dimensions | Application |
|---|---|---|---|---|---|
| RGC-20 | Resin type | GC | 1mm | 75 × 75 | #2000 |
| RGC-30 | Resin type | GC | 1mm | 75 × 75 | #3000 |
| RGC-35 | Resin type | GC | 1mm | 75 × 75 | #3500 |
| RGC-40 | Resin type | GC | 1mm | 75 × 75 | #4000 |
| RGC-50 | Resin type | GC | 1mm | 75 × 75 | #5000 |
| RGC-60 | Resin type | GC | 1mm | 75 × 75 | #6000 |
Processing Target and Processing Example
Silicon pre-cut and dressing plate
Silicon pre-cut
Blade tip comparison of RGC series
When using RGC
