Wafer Dicing – Blades

Dicing blades are saw blades which are used in fully and semi-automated blade dicing machines. The selection of the right kind of dicing blade is a prerequisite for good sawing quality, with high-precision cut edges. ACCRETECH precision dicing blades are available for a vast range of applications and wafer materials. Unique electroplating technology ensures even granulation distribution, and high stability. We also offer our customers dressing plates, in order to avoid clogging

Dicing Blades - Accretech - 010_hubtype_ue - Kopie

 Hub Type Blades

For high speed and long service life

Dicing Blades - Accretech - 004_nickel_GS

 Blades with Nickel Bonds

For high rigidity and low erosion

Dicing Blades - Accretech - 011_metal_sow

 Ultra-hard Metal Blades

For sawing metal substrates

Dicing Blades - Accretech - 009_resin_NMR

 Blades with Synthetic Resin Bonds

Long service life, high speed, and improved process stability

 Blades with Metal Bonds

With excellent properties for sawing ceramics and glass

Dincing Blades

Long service life, low erosion, high speed. Difficult materials such as glass, ceramics or metal substrates can also be cut using the different saw blades.
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 Hub Type Blades
 Blades with Nickel Bonds
 Ultra-hard Metal Bonds
 Blades with Synthetic Resin Bonds
 Blades with Metal Bonds