SS30
Semi-automatic Wafer Dicing machine for 300 mm
Small ecological footprint
Wide Scope of Application
High User Friendliness
Wide Scope of Application
High User Friendliness
- Suitable for different types of workpieces: 12-inch Frame, rectangular workpieces with max. 350 x 250 mm
- Higher X-axis throughput 800 mm/sec, Y-axis 300 mm/sec and Z-axis 80mm/sec
- Standard Spindle up to 60,000 rpm, optional High Speed Spindle up to 80,000 rpm, High Power Spindle with 30,000 rpm
- Microscope with High Resolution
- Easy & Simple Kerf Check Function
- Simple operation with 17-Inch Touch Panel and new Graphical User Interface
- USB Port as a standard option
- Simple maintenance – easy to access
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