SS20

Semi-automatic Dicer Machine from the new Small Footprint Generation.

Lower Resource Consumption

Versatile for Application

Very Easy to Handle
Das Bild ist eine Darstellung einer SS20 in der Frontansicht.
  • Also suitable for quadratic wafers up to 250 mm
  • Microscope with High Resolution
  • Easy & simple Kerf Check Function
  • Simple operation with 17-Inch Touch Panel and new Graphical User Interface
  • Standard spindle up to 60,000 rpm, optional High Speed Spindle with 80,000 rpm

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