AD2000T/S
Very compact, fully automatic Wafer Dicing machine for 200 mm
Smallest dicing machine in the world
Highest Space Efficiency
High Throughput
Low Cost of Ownership
Highest Space Efficiency
High Throughput
Low Cost of Ownership
- High Processing Speed
- X-axis up to 1,000 mm/ Y-axis up to 300 mm/s
- The smallest blade-to-blade distance worldwide
- Graphical User Interface with Help Function
- Easy & Simple Kerf Check Function
- Standard Spindle up to 60,000 rpm, optional High Speed Spindle up to 80,000 rpm
- Simple Maintenance – Easy to Access
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