Wafer Dicing Machines – Blade Dicer

The task of the Wafer Dicing Machines is to separate the whole wafers into chips. Blade Dicers cut the wafers using fine saw blades. Our semi and fully automatic ACCRETECH Blade Dicers are available for wafers up to 150 mm, 200 mm and 300 mm diameter. In addition to user-friendliness, their excellent properties include high processing speed and the very compact construction. The AD2000T and AD3000T, with two opposite-facing spindles, are the smallest fully automatic Blade Dicers in the world, setting new standards with their small footprint and high-efficiency.

Blade Dicer Laser Dicer Dicing Blades

≤ 150 mm

Semi-automatic Blade Dicers with a high throughput and a reduced footprint. The 17 inch Touch Panel Screen also making it particularly easy to handle.

SS10

≤ 200 mm

High stability, low vibration, user-friendliness and environmental sustainability are also some of the most important features of the 200 mm Blade Dicer as well.

SS20
AD20T
AD2000T/S

≤ 300 mm

High Performance Spindle or Twin Dicing Technology with 2 spindles – the best conditions for producing 300 mm large wafer chips with the maximum yield.

SS30
AD3000T/S

Accessories

Wafer Cleaner

Cutting water recycling System

DI Water Generator

Dispenser unit

Temperature Controller

Dicing Blades

Durable, stable and extremely precise. Difficult materials and extremely thin wafers can also be combined using the different saw blades.
Hub Type Blades
Blades with Nickel Bonds
Blades with Metal Bonds
Blades with Synthetic Resin Bonds
Ultra-hard Metal Blades