Product list semiconductor

Wafer Probing Machines

≤ 200 mm Prober
UF190R
UF200R
UF2000

≤ 300 mm Prober
UF3000EX-e
UF3000EX

Wafer und Frame Prober
FP2000
FP3000

Grinding Machines

High Rigid Grinder

≤ 200 mm Grinder
HRG200X

≤ 300 mm Grinder
HRG300
HRG300 A

Polish Grinder

Wafer Edge Grinder

≤ 200 mm Grinder
W-GM-4200

≤ 300 mm Grinder
W-GM-5200

≤ 450 mm Grinder
W-GM-6200

Wafer Dicing Machines

Package Dicer

Dicing Blades

Hub Type Blades
Blades with Nickel Bonds
Blades with Metal Bonds
Blades with Synthetic Resin Bonds
Ultra-hard Metal Blades

CMP

≤ 200 mm
ChaMP 211/232

≤ 300 mm
ChaMP 311 / 332