W-GM-6200
Edge grinding machine for the new generation of 450 mm wafers
Precise profiling of large wafers
Integrated quality control
Outstanding results
Integrated quality control
Outstanding results
- Improved use of space due to the compact design
- High grinding precision thanks to synchronised X, Y, θ Support Control
- Simple operation with the Touch Panel
- Automatic Feedback from the preparation results
- Optimum preparation of the subsequent process steps
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