W-GM-5200
Edge grinding machine for wafer manufacturing up to 300 mm
Wide Scope of Application
High Degree of Process Security
High-Precision Quality Control
High Degree of Process Security
High-Precision Quality Control
- Suitable for various wafer materials and connections for example GaAs, SiC, GaN etc.
- Newly developed Grinding Unit for better rotational precision of the spindle and the profile sharpness
- non-contact measurement technology ensures stable alignment
- Performs a non-contact measurement of the wafer thickness at numerous different locations before grinding
- Performs a non-contact measurement of the diameter and the indent depth
- Mirror Finish Technology to reduce grinding damage
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