W-GM-4200

Edge grinding machine for wafer manufacturing up to 200 mm

Wide Scope of Application

High Grinding Precision

Compact Design

Easy to Operate
ACCRTECH Europe GmbH - Produkte - Semiconductor - %%title%%
  • Suitable for various wafer materials, for example GaAs, SiC, GaN etc.
  • Newly developed Grinding Unit for better rotational precision of the spindle and the profile sharpness
  • non-contact measurement technology ensures stable alignment
  • Performs a non-contact measurement of the wafer thickness at numerous different locations before grinding
  • Performs a non-contact measurement of the diameter and the indent depth
  • Mirror Finish Technology to reduce grinding damage
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