PG3000RMII
Polish Grinder for simultaneous thinning and defect removal of wafers up to 300 mm
Innovative Technologies
2 work steps in one
High Efficiency
Flawless Results
2 work steps in one
High Efficiency
Flawless Results
- Grinder + CMP Stress Release
- Higher throughput – for 15 µm wafer thinning in high volume production
- The RM200/300 module (Wafer Mounter/Remounter) offers complementary PG200/300 Processing in one unit – it removes the protective tape from thinner wafers and applies the wafers to the dicing frames
- Performs pre-grinding, fine grinding, polishing and cleaning of both sides of the wafer in the machine
- All processes are carried out on the same chuck – the wafer does not need to be moved
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