ChaMP 211/232

High Performance CMP Technology for wafers up to 200mm

Maximum Process Safety

Optimum Interaction of all Components

Outstanding Results

Can be configured for high volumes
Accretech GmbH - Produkte - CMP - CHAMP
  • Modular, flexible and compact design
  • Dry in Dry Cut with cleaning option
  • Polishing head with Air Float Technology
  • Easy Maintenance
  • End Point Detection (EPD) for high precision and even polishing
  • Processed Cu / STI/ ILD / SOI etc.
  • For ChaMP 232, also with 3 polishing tables and 2 polishing heads – ideal for mass production
Print Friendly, PDF & Email

Related products

We are here for you

+49 (0)89 546788-0


Contact form

How can we best contact you?