FP3000
Tried-and-tested 300 mm Frame Handling Prober with Frame Gripper Function
For 300 mm Wafers on Dicing Frames
Numerous safety functions
Available with wafer handling on request
Product-specific configuration
Numerous safety functions
Available with wafer handling on request
Product-specific configuration
- For Wafers up to 300 mm on Dicing Frames
- Optionally with wafer handling – for maximum versatility in production
- Software to correct the chip position
- Automatic wafer alignment
- Automatic sample needle for contact point alignment
- Optional with multiple probing, needle cleaning, GP-IB interface, sample inspection, printer, barcode reader, wafer ID reader, color camera and flat loader
