FP2000
Fully automatic 200 mm Frame Handling Prober with Frame Gripper Function
Highest standard safety
Various options for use
Also for Wafers on Dicing Frames
Modular – can be extended at any time
Various options for use
Also for Wafers on Dicing Frames
Modular – can be extended at any time
- For testing all wafers as well as wafers on Dicing Frames
- For wafers on Dicing Frames 2-8- 1, 2-6- 1
- For normal 5, 6 and 8 inch wafers
- Newly developed software to correct the chip position
- Automatic alignment of the wafer
- Automatic probe needle for contact point adjustment
- Optionally with Multiple Die Probing, spindle cleaning, GP-IB Interface, Probe-mark Inspection, Printer, Barcode Reader, Wafer ID Reader, Colour Camera and Flat Loader
