Wafer Edge Grinding

After the sawing of the wafer from the ingot, the wafers have sharp edges which are rounded with a diamond cutter during the Wafer Edge Grinding. The wafers are optimally prepared for the subsequent process steps by the Edge Grinding. It is ensured that no layers applied later are able to flake. Round, smooth polished edges are also important so that the bead of the photoresist surface remains small when spin coating.

≤ 200 mm Grinder

For perfectly rounded, stable wafer edges, which greatly improve subsequent handling.

 W-GM-4200

≤ 300 mm Grinder

Productive edge grinding machine for large discs up to 300 mm diameter.

 W-GM-5200

≤ 450 mm Grinder

Reliable and easy to use. For edge profiles on wafers up to 450 mm diameter

 W-GM-6200

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