Wafer Dicing Machines – Package Dicer

Remain competitive. Reduced costs and increased efficiency are increasingly important in the high volume production of semiconductor elements. With our Dicer package, we offer a complete solution for the separation of BGA and QFN products. The dicing machine is directly coupled to a pick-and-place system. With its newly developed technology with two independent stages and transportation routes, this dicer has great potential for reducing operating costs (“cost of ownership”)