ChaMP 332: High-volume CMP for 300mm wafer

ChaMP 332

High Performance CMP Technology for wafers up to 300mm

Maximum Process Safety

Optimum Interaction of all Components

Outstanding Results

Can be configured for high volumes

Modular and compact design
Dry in Dry Cut with cleaning option
Polishing head with Air Float Technology
Easy Maintenance
End Point Detection (EPD) for high precision and even polishing
Processed Cu / STI/ ILD / SOI etc.
For ChaMP 332 also with 3 polishing tables and 2 polishing heads – ideal for mass production

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