SS10
Semi-automatic Dicer Machine from the new Small Footprint Generation.
Low space requirement
High flexibility
High speed
Low scrap production
High flexibility
High speed
Low scrap production
- Smallest and quickest 6 inch Dicing Machine in the world
- Suitable for various types of wafers
- Image preparation processor automatically adapts to the different wafers
- High Performance Spindle with 60,000 rpm
- 14-Inch Touch Panel and new Graphical User Interface
- Microscope with High Resolution
- Easy & simple kerf check function
- Simple operation with 17-Inch Touch Panel and new Graphical User Interface
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